微电子封装组件的建模和仿真：制造、可靠性与测试
作者：刘胜，刘勇 著
出版时间：2012年版
内容简介
　　随着电子封装的发展，电子封装已从传统的四个主要功能（电源系统、信号分布及传递、散热及机械保护）扩展为六个功能，即增加了DFX及系统测试两个新的功能。其中DFX是为“X”而设计，X包括：可制造性、可靠性、可维护性、成本，甚至六西格玛。DFX有望在产品设计阶段实现工艺窗口的确定、可靠性评估和测试结构及参数的设计等功能，真正做到“第一次就能成功”，从而将计算机辅助工程（CAE）变为计算机主导工程（CE），以大大加速产品的上市速度。本书是全面介绍DFX在封装中应用的图书。作为封装工艺过程和快速可靠性评估及测试建模仿真的第一本专著，《微电子封装组件的建模和仿真：制造可靠性与测试》中包含两位作者刘胜、刘勇在工业界二十多年的丰富经验，以及在MEMS、IC和LED封装部分成功的实例，希望能给国内同行起到抛砖引玉的作用。同时，读者将会从书中的先进工程设计和微电子产品的并行工程和协同设计方法中受益。《微电子封装组件的建模和仿真：制造可靠性与测试》主要读者对象为学习DFX（制造工艺设计、测试设计、可靠性设计等）的研究人员、工程师和学生等。
目录
Foreword
Foreword
Preface
Acknowledgments
About the Autho
Part I Mechanics and Modeling
1 Co titutive Models and Finite Element Method
1.1 Co titutive Models for Typical Materials
1.1.1 Linear Elasticity
1.1.2 Elastic-Visco-Plasticity
1.2 Finite Element Method
1.2.1 Basic Finite Element Equatio
1.2.2 Nonlinear Solution Methods
1.2.3 Advanced Modeling Techniques in Finite
Element Analysis
1.2.4 Finite Element Application in Semiconductor
Packaging Modeling
1.3 Chapter Summary
References
2 Material and Structural Testing for Small Samples
2.1 Material Testing for Solder Joints
2.1.1 Specime
2.1.2 A Thermo-mechanical Fatigue Tester
2.1.3 Te ile Test
2.1.4 Creep Test
2.1.5 Fatigue Test
2.2 Scale Effect of Packaging Materials
2.2.1 Specime
2.2.2 Experimental Results and Discussio
2.2.3 Thin Film Scale Dependence for Polymer Thin Films
2.3 Two-ball Joint Specimen Fatigue Testing
2.4 Chapter Summary
References
3 Co titutive and Use-supplied Subroutines for Solde
Co idering Damage Evolution
3.1 Co titutive Model for Tin-lead Solder Joint
3.1.1 Model Formulation
3.1.2 Determination of Material Co tants
3.1.3 Model Prediction
3.2 Visco-elastic-plastic Properties and Co titutive Modeling of Under?lls
3.2.1 Co titutive Modeling of Under?lls
3.2.2 Identi?cation of Material Co tants
3.2.3 Model Veri?cation and Prediction
3.3 A Damage Coupling Framework of Uni?ed Viscoplasticity
for the Fatigure of Solder Alloys
3.3.1 Damage Coupling Thermodynamic Framework
3.3.2 Large Deformation Formulation
3.3.3 Identi?cation of the Material Paramete
3.3.4 Creep Damage
3.4 User-supplied Subroutines for Solde Co idering
Damage Evolution
3.4.1 Return-Mapping Algorithm and FEA Implementation
3.4.2 Advanced Features of the Implementation
3.4.3 Applicatio of the Methodology
3.5 Chapter Summary
References
4 Accelerated Fatigue Life Assessment Approaches for Solde
in Packages
4.1 Life Prediction Methodology
4.1.1 Strain-Based Approach
4.1.2 Energy-Based Approach
4.1.3 Fracture Mechanics-Based Approach
4.2 Accelerated Testing Methodology
4.2.1 Failure Modes via Accelerated Testing Bounds
4.2.2 Isothermal Fatigue via Thermal Fatigue
4.3 Co titutive Modeling Methodology
4.3.1 Separated Modeling via Uni?ed Modeling
4.3.2 Viscoplasticity with Damage Evolution
4.4 Solder Joint Reliability via FEA
4.4.1 Life Prediction of Ford Joint Specimen
4.4.2 Accelerated Testing: I ights from Life Prediction
4.4.3 Fatigue Life Prediction of a PQFP Package
4.5 Life Prediction of Flip-Chip Packages
4.5.1 Fatigue Life Prediction with and without Under?ll
4.5.2 Life Prediction of Flip-Chips without Under?ll via Uni?ed and Separated
Co titutive Modeling
4.5.3 Life Prediction of Flip-Chips under Accelerated Testing
4.6 Chapter Summary
References
5 Multi-physics and Multi-scale Modeling
5.1 Multi-physics Modeling
5.1.1 Direct-coupled Analysis
5.1.2 Sequential Coupling
5.2 Multi-scale Modeling
5.3 Chapter Summary
References
6 Modeling Validation Tools
6.1 Structural Mechanics Analysis
6.2 Requirements of Experimental Methods for Structural
Mechanics Analysis
6.3 Whole Field Optical Techniques
6.4 Thermal Strai Measurements Using Moir e Interferometry
6.4.1 Thermal Strai in a Plastic Ball Grid Array
（PBGA） Interconnection
6.4.2 Real-time Thermal Deformation Measurements
Using Moir e Inteferometry
6.5 In-situ Measurements on Micro-machined Se o
6.5.1 Micro-machined Membrane Structure
in a Chemical Se or
6.5.2 In-situ Measurement Using Twyman-Green
Interferometry
6.5.3 Membrane Deformatio due to Power Cycles
6.6 Real-time Measurements Using Speckle Inteferometry
6.7 Image Processing and Computer Aided Optical Techniques
6.7.1 Image Processing for Fringe Analysis
6.7.2 Phase Shifting Technique for Increasing
Displacement Resolution
6.8 Real-Time Thermal-Mechanical Loading Tools
6.8.1 Micro Mechanical Testing
6.8.2 Environmental Chamber
6.9 Warpage Measurement Using PM-SM System
6.9.1 Shadow Moir e and Project Moir e Setup
6.9.2 Warpage Measurement of a BGA, Two Crowded PCBs
6.10 Chapter Summary
References
7 Application of Fracture Mechanics
7.1 Fundamental of Fracture Mechanics
7.1.1 Energy Release Rate
7.1.2 J Integral
7.1.3 Interfacial Crack
7.2 Bulk Material Cracks in Electronic Packages
7.2.1 Background
7.2.2 Crack Propagation in Ceramic/Adhesive/Glass System
7.2.3 Results
7.3 Interfacial Fracture Toughness
7.3.1 Background
7.3.2 Interfacial Fracture Toughness of Flip-chip Package
between Passivated Silicon Chip and Under?ll
7.4 Three-dime ional Energy Release Rate Calculation
7.4.1 Fracture Analysis
7.4.2 Results and Comparison
7.5 Chapter Summary
References
8 Concurrent Engineering for Microelectronics
8.1 Design Optimizatio
8.2 New Developments and Trends in Integrated
Design Tools
8.3 Chapter Summary
References
9 Typical IC Packaging and Assembly Processes
9.1 Wafer Process and Thinning
9.1.1 Wafer Process Stress Models
9.1.2 Thin Film Deposition
9.1.3 Backside Grind for Thinning
9.2 Die Pick Up
9.3 Die Attach
9.3.1 Material Co titutive Relatio
9.3.2 Modeling and Numerical Strategies
9.3.3 FEA Simulation Result of Flip-Chip Attach
9.4 Wire Bonding
9.4.1 Assumption, Material Properties and Method of Analysis
9.4.2 Wire Bonding Process with Different Paramete
9.4.3 Impact of Ultrasonic Amplitude
9.4.4 Impact of Ultrasonic Frequency
9.4.5 Impact of Friction Coef?cients between Bond Pad and FAB
9.4.6 Impact of Different Bond Pad Thickness
9.4.7 Impact of Different Bond Pad Structures
9.4.8 Modeling Results and Discussion for Cooling Substrate
Temperature after Wire Bonding
9.5 Molding
9.5.1 Molding Flow Simulation
9.5.2 Curing Stress Model
9.5.3 Molding Ejection and Clamping Simulation
9.6 Leadframe Forming/Singulation
9.6.1 Euler Forward ve us Backward Solution Method
9.6.2 Punch Process Setup
9.6.3 Punch Simulation by ANSYS Implicit
9.6.4 Punch Simulation by LS-DYNA
9.6.5 Experimental Data
9.7 Chapter Summary
References
10 Opto Packaging and Assembly
10.1 Silicon Substrate Based Opto Package Assembly
10.1.1 State of the Technology
10.1.2 Monte Carlo Simulation of Bonding/Soldering Process
10.1.3 Effect of Matching Fluid
10.1.4 Effect of the Encapsulation
10.2 Welding of a Pump Laser Module
10.2.1 Module Description
10.2.2 Module Packaging Process Flow
10.2.3 Radiation Heat Tra fer Modeling for Hermetic
Sealing Process
10.2.4 Two-Dime ional FEA Modeling for Hermetic Sealing
10.2.5 Cavity Radiation Analyses Results and Discussio
10.3 Chapter Summary
References
11 MEMS and MEMS Package Assembly
11.1 A Pressure Se or Packaging （Deformation and Stress）
11.1.1 Piezoresistance in Silicon
11.1.2 Finite Element Modeling and Geometry
11.1.3 Material Properties
11.1.4 Results and Discussion
11.2 Mounting of Pressure Se or
11.2.1 Mounting Process
11.2.2 Modeling
11.2.3 Results
11.2.4 Experiments and Discussio
11.3 Thermo-Fluid Based Accelerometer Packaging
11.3.1 Device Structure and Operation Principle
11.3.2 Linearity Analysis
11.3.3 Design Co ideration
11.3.4 Fabrication
11.3.5 Experiment
11.4 Plastic Packaging for A Capacitance Based Accelerometer
11.4.1 Micro-Machined Accelerometer
11.4.2 Wafer-Level Packaging
11.4.3 Packaging of Capped Accelerometer
11.5 Tire Pressure Monitoring System （TPMS） Antenna
11.5.1 Test of TPMS System with Wheel Antenna
11.5.2 3D Electromagnetic Modeling of The Wheel Antenna
11.5.3 Stress Modeling of I talled TPMS
11.6 Thermo-Fluid Based Gyroscope Packaging
11.6.1 Operating Principle and Design
11.6.2 Analysis of Angular Acceleration Coupling
11.6.3 Numerical Simulation and Analysis
11.7 Microjets for Radar and LED Cooling
11.7.1 Microjet Array Cooling System
11.7.2 Preliminary Experiments
11.7.3 Simulation and Model Veri?cation
11.7.4 Comparison and Optimization of Three Microjet Devices
11.8 Air Flow Se or
11.8.1 Operation Principle
11.8.2 Simulation of Flow Conditio
11.8.3 Simulation of Temperature Field on the Se or
Chip Surface
11.9 Direct Numerical Simulation of Particle Separation
by Direct Current Dielectrophoresis
11.9.1 Mathematical Model and Implementation
11.9.2 Results and Discussion
11.10 Modeling of Micro-Machine for Use in Gastrointestinal Endoscopy
11.10.1 Methods
11.10.2 Results and Discussion
11.11 Chapter Summary
Reference
12 System in Package （SIP） Assembly
12.1 Assembly Process of Side by Side Placed SIP
12.1.1 Multiple Die Attach Process
12.1.2 Cooling Stress and Warpage Simulation after Molding
12.1.3 Stress Simulation in Trim Process
12.2 Impact of the Nonlinear Materials Behavio on the Flip-chip
Packaging Assembly Reliability
12.2.1 Finite Element Modeling and Effect of Material Models
12.2.2 Experiment
12.2.3 Results and Discussio
12.3 Stacked Die Flip-chip Assembly Layout and the Material Selection
12.3.1 Finite Element Model for the Stack Die FSBGA
12.3.2 Assembly Layout Investigation
12.3.3 Material Selection
12.4 Chapter Summary
References
Part III Modeling in Microelectronic Package Reliability and Test
13 Wafer Probing Test
13.1 Probe Test Model
13.2 Parameter Probe Test Modeling Results and Discussio
13.2.1 Impact of Probe Tip Geometry Shapes
13.2.2 Impact of Contact Friction
13.2.3 Impact of Probe Tip Scrub
13.3 Comparison Modeling: Probe Test ve us Wire Bonding
13.4 Design of Experiment （DOE） Study and Correlation of Probing
Experiment and FEA Modeling
13.5 Chapter Summary
References
14 Power and Thermal Cycling, Solder Joint Fatigue Life
14.1 Die Attach Process and Material Relatio
14.2 Power Cycling Modeling and Discussion
14.3 Thermal Cycling Modeling and Discussion
14.4 Methodology of Solder Joint Fatigue Life Prediction
14.5 Fatigue Life Prediction of a Stack Die Flip-chip on Silicon （FSBGA）
14.6 Effect of Cleaned and Non-Cleaned Situatio on the Reliability
of Flip-Chip Packages
14.6.1 Finite Element Models for the Clean and Non-Clean Cases
14.6.2 Model Evaluation
14.6.3 Reliability Study for the Solder Joints
14.7 Chapter Summary
References
15 Passivation Crack Avoidance
15.1 Ratcheting-Induced Stable Cracking: A Synopsis
15.2 Ratcheting in Metal Films
15.3 Cracking in Passivation Films
15.4 Design Modi?catio
15.5 Chapter Summary
References
16 Drop Test
16.1 Controlled Pulse Drop Test
16.1.1 Simulation Methods
16.1.2 Simulation Results
16.1.3 Parametric Study
16.2 Free Drop
16.2.1 Simulated Drop Test Procedure
16.2.2 Modeling Results and Discussion
16.3 Portable Electronic Devices Drop Test and Simulation
16.3.1 Test Set Up
16.3.2 Modeling and Simulation
16.3.3 Results
16.4 Chapter Summary
References
17 Electromigration
17.1 Basic Migration Formulation and Algorithm
17.2 Electromigration Examples from IC Device and Package
17.2.1 A Sweat Structure
17.2.2 A Flip-chip CSP with Solder Bumps
17.3 Chapter Summary
References
18 Popcorning in Plastic Packages
18.1 Statement of Problem
18.2 Analysis
18.3 Results and Compariso
18.3.1 Behavior of a Delaminated Package due to Pulsed
Heating-Veri?cation
18.3.2 Convergence of the Total Strain Energy Release Rate
18.3.3 Effect of Delamination Size and Various Processes
for a Thick Package
18.3.4 Effect of Moisture Expa ion Coef?cient
18.4 Chapter Summary
References
Part IV Modern Modeling and Simulation Methodologies
19 Classical Molecular Dynamics
19.1 General Description of Molecular Dynamics Method
19.2 Mechanism of Carbon Nanotube Welding onto the Metal
19.2.1 Computational Methodology
19.2.2 Results and Discussion
19.3 Applicatio of Car–Parrinello Molecular Dynamics
19.3.1 Car–Parrinello Simulation of Initial Growth Stage
of Gallium Nitride on Carbon Nanotube
19.3.2 Effects of Mechanical Deformation on Outer Surface
Reactivity of Carbon Nanotubes
19.3.3 Adsorption Con?guration of Magnesium on Wurtzite
Gallium Nitride Surface Using Fi t-principles Calculatio
19.4 Nano-welding by RF Heating
19.5 Chapter Summary
References
Appendix
Summary of Continuous Mechanics
Index




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